Good News | PrecisioNext Selected as a "Guangdong Provincial Engineering Technology Research Center," Empowering the Development of Advanced Packaging Equipment!

PrecisioNext: Congratulations to PrecisioNext on Being Honored as a National-Level Specialized, Refined, Distinctive and Innovative "Little Giant" Enterprise

Domestic AI Chip Breakthrough: Domestic TCB Equipment Completes CoWoS Packaging Process Test for the First Time

Directly tackling industry pain points, PrecisioNext launches a one-stop 800G/1.6T optical module placement solution, supplying top-tier manufacturers.

Targeting HBM and AI Chips, PrecisioNext Announces the Major Launch of Its Loong Series TCB Advanced Packaging Equipment.

PrecisioNext won the "Best Brand Award" for China Semiconductor Packaging and Testing Equipment from 2022 to 2023

Good news! PrecisioNext was awarded the title of "SMEs" in Guangdong Province

PrecisioNext was elected as the vice president unit of Shenzhen Semiconductor Industry Association

Big release! PrecisioNext CEO Tian Xingyin was selected as the DARHORSE of “Industrial Innovation 100 Talents List 2021”