EU406 Inline High Precision Eutectic Die Bonder

    Product features

  • EU406 Inline High Precision Eutectic Die Bonder

    High Precision: X/Y placement accuracy: ±1.5μm @3σ; Theta placement accuracy: <0.1°@3σ;

    High speed: COC placement cycle time ≤10s (Excluding temperature curve);

    Supports 6pcs 6" wafers or 24pcs 2" waffle packs/2" GEL-Pak;

    Automatic nozzle changer; Equipped with double ejector tools;

    The multi-nozzle structure simultaneously picks and places multiple components, while the three bond heads improve overall efficiency;

    Configurable nozzle heating; Features dual eutectic stages;

    Maximum temperature 450°C, heating rate up to 60°C/s, cooling rate up to 50°C/s.

    Nitrogen and formic acid protective gas atmosphere;

    Top-vision inspection function; Vision-guided system for automatic height and position calibration;

    Supports multi-segment temperature control with real-time temperature profile display;

    Auto IQC system, SECS/GEM supported; Highly automated conveyor system for material handling.


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