PA (Pick) Accuracy: Accuracy: ±1.5 µm @ 3σ Angle: ±0.2° @ 3σ

BA (Bond) Accuracy: Accuracy: ±1.5 µm @ 3σ Angle: ±0.2° @ 3σ

Speed: Die bonding cycle: 4.5 s (excluding eutectic time).

Nozzle count > 8, with counting, self-check, and self-calibration (height) functions.

Both pick head and bond head are equipped with a three-nozzle structure, capable of picking three different materials without nozzle change, greatly shortening the production cycle.

High automation: Fully automatic in-line conveyor transfer and unloading system, in-line production, supporting standard SMEMA protocol.

Wafer stage: Supports 2 pcs of 8" wafer, 2pcs of 6" wafer(or 16 pcs of 2" waffle packs / 2" GEL-Pak), wide material compatibility.

Vision-guided dispensing system with automatic calibration of dispensing height and position.

Automatic accuracy and pressure calibration.

Automatic saving of bonding profile data, including time–temperature–pressure data.

Multi-stage temperature control with real-time temperature profile display.

Dual eutectic stages: Max. 450 °C, heating rate max. 50 °C/s, cooling rate max. 30 °C/s.