Clip Bonder High-speed Clip Bonding System-Precision Intelligent Technology Co., Ltd

Product features

Clip Bonder High-speed Clip Bonding System

placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;
Up to 20Clips / Cycle;
Prebond & Posbond function;
Solder patch & solder paste inspection function;
High precision linear drive die bond head;
High precision clip punching system;
The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;
Multiple configurations meet various market demands, as well as customization according to special demands;
Freely match various types of reflow equipment.


Advantages of Die Attach DA801/DA1201 can be configured; Placement accuracy: ±10-25μm@3σ; Theta placement accuracy: ±1°@3σ; Stable force control system; Dual dispensing system, support dipping / jetting / writing epoxy process.		Advantages of Clip Bond Placement accuracy: ±50μm@3σ; Theta placement accuracy: ±3°@3σ; Reducing packaging size; Improving thermal conductivity; As the parasitic resistance is reduced, the electrical characteristics are improved.		Advantages of Vacuum Reflow Using industrial control embedded control system; Providing a replaceable heating module; Flux solder paste automatic recovery system; Intelligent nitrogen monitoring and controlling system; Stepwise vacuum design, which can be divided into 5 steps maximally;