Clip Bonder High-speed Clip Bonding System

    Product features

  • Clip Bonder High-speed Clip Bonding System

    placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;

    Up to 20Clips / Cycle;

    Prebond & Posbond function;

    Solder patch & solder paste inspection function;

    High precision linear drive die bond head;

    High precision clip punching system;

    The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;

    Multiple configurations meet various market demands, as well as customization according to special demands;

    Freely match various types of reflow equipment.

  • Return to the top

  • +86-769-26622766-816

  • Scan the code to open mobile website

  • Scan the code by WeChat to follow us