Product features
High precision: X/Y placement accuracy: ±3μm@3σ(standard sheet 1.5μm);
Theta placement accuracy:±0.1°@3σ;
High speed: patch cycle ≤4.5S (UPH≥800);
Electronic control Pick/Bond Force, the maximum Bond Force is 2500g;
Support for Die face up/face down bonding;
Auto suction nozzle change, max 12 nozzles;
Equipped with 5 ejector tools forvarious sizes of Die;
Automatic bond force calibration function;
Automatic wafer mapping, maximum support for 12’wafer;
Independently contorlled dual epoxy writing system, and high quantity epoxy control;
Inline supporting with standard function;
Class100 for cleanroom.

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| High Precision X/Y placement accuracy: ±3µm @3σ; Theta placement accuracy: ±0.1°@3σ; Repositioning accuracy:±0.5µm@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle. | Dual Epoxy writing System Independently contorlled dual epoxy writing system, and high quantity epoxy control; Automatic wafer mapping, maximum support for 12’wafer; Suitable for packaging such as COB, COS, AOC, BOX, etc. | Automatic nozzle changer Auto suction nozzle change, max 12 nozzles; Equipped with 5 ejector tools for various sizes of Die; Inline supporting with standard function. | ||
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| High Error-proof Function Support glue dispensing, glue quantity detection and alarm function; Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost. | Pattern Recognition System USB 3.0, CCD, 4000x3000 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.1 degrees; | Control System Highly stable force control system uses voice coil twisting ring and encoder to control the bonding pressure. The bond force is programmable varying from 20 to 2500g; User-friendly interface supports EPOXY IQC and POST IQC graphic display. |