Light 2300 Ultra-high Precision Die Attach

    Product features

  • Light 2300 Ultra-high Precision Die Attach

    High precision: X/Y placement accuracy: ±3μm@3σ(standard sheet 1.5μm);

    Theta placement accuracy:±0.1°@3σ;

    High speed: patch cycle ≤4.5S (UPH≥800);

    Electronic control Pick/Bond Force, the maximum Bond Force is 2500g;

    Support for Die face up/face down bonding;

    Auto suction nozzle change, max 12 nozzles;

    Equipped with 5 ejector tools forvarious sizes of Die;

    Automatic bond force calibration function;

    Automatic wafer mapping, maximum support for 12’wafer;

    Independently contorlled dual epoxy writing system, and high quantity epoxy control;

    Inline supporting with standard function;

    Class100 for cleanroom.


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