-Precision Intelligent Technology Co., Ltd

Product features

Phoenix 350 Lite Thermal Comperssion Bonder

High Precision: ±0.5μm @3σ; Angle ±0.01° @3σ;
Supports 6pcs 6" or 3pcs 8" wafer rings (wafer, waffle pack, gel-pak);
Automatic nozzle changer, Equipped with double ejector tools;
Bonding head heating function: 450℃ ±2.5℃; Substrate heating function: 350℃ ±3.5℃;
Highly stable force control system, supporting ultra-low placement force, wide controllable range of placement force, programmable force adjustment, range 10g-10kg (depending on configuration), force control accuracy 2%;
Support for Die face up/face down bonding；
Supports multiple bonding methods (adhesive bonding, TC bonding, ultrasonic bonding);
Compatible with nitrogen, formic acid, nitrogen-hydrogen mixed atmosphere, supports NCF/NCP/TCCUF, and also enables fluxless processes for higher yield;
Ultra-high-definition PLXvision™ alignment system; Auto IQC system, SECS/GEM(MES) supported;
Highly automated, supports manual and fully automatic loading/unloading conveyor systems.


High Precision X/Y placement accuracy: ±0.5µm @3σ; Theta placement accuracy: ±0.01°@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	6pcs 6" or 3pcs 8" Wafers Various material loading formats (wafer, waffle pack, gel-pak)； Equipped with double ejector tools； Optional automatic nozzle changer; Closed loop force control.	Heated Bonding Head Supports chips up to 35mm x 35mm; Precise temperature control function , maximum heating rate 60℃/s, maximum cooling rate 50℃/s; Auto-leveling function; Substrate heating stage: 350℃ ±3.5℃.

Supports Flip Chip High precision, high responsiveness; Modular design, flexible configuration for die face-up /face-down bonding; Supports flux dipping module.	Multiple Bonding Methods Multiple bonding methods (adhesive bonding, TC bonding, ultrasonic bonding); High-density interconnection with simultaneous heating and pressing; Ultra-high alignment accuracy, suitable for ultra-fine pitch applications.	Formic Acid Atmosphere Bonding Safer and more reliable soldering method, residue-free and no-clean; More reliable solder joints with enhanced thermal conductivity; Compatible with NCF/NCP/TCCUF and Fluxless processes, leading to higher yields.