-Precision Intelligent Technology Co., Ltd

Product features

Light 2200 Inline Ultra-high Precision Die Attach

High precision:
X/Y placement accuracy: ±3μm @3 σ
(standard sheet 1.5μm)；
Theta placement accuracy:±0.1° @3 σ；
High speed: patch cycle ≤4.5S (UPH≥800)；
Electronic control Pick/Bond Force, the maximum Bond Force is 500g；
Auto suction nozzle change, max 12 nozzles；
Equipped with 3 ejector tools forvarious sizes of Die；
6pcs 6"wafer rings or 1pcs 8" and 5pcs 6" wafer rings (2" waffle-pack, Gel-Pak)；
Independently contorlled dual epoxy writing system, and high quantity epoxy control；
Supports inline UV curing for UV adhesive；
Inline supporting with standard function.


High Precision X/Y placement accuracy: ±3µm @3σ; Theta placement accuracy: ±0.1°@3σ; Repositioning accuracy:±0.5µm@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	Dual Epoxy writing System Independently contorlled dual epoxy writing system, and high quantity epoxy control； 6pcs 6"wafer rings or 1pcs 8" and 5pcs 6" wafer rings(2" waffle-pack, Gel-Pak)； Suitable for packaging such as COB, COS, AOC, BOX, etc.	Automatic nozzle changer Auto suction nozzle change, max 12 nozzles； Equipped with 3 ejector tools for various sizes of Die； Inline supporting with standard function.

High Error-proof Function Supporting glue dispensing, glue quantity detection and alarm function; Auto IQC system, SECS/GEM supported.	Pattern Recognition System USB 3.0, CCD, 4000x3000 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.01 degrees;	Force Control System Highly stable force control system, using VCM and encoder to control bond force. Can adjust the force by programming. Ranging from 20~500g (Progammable); Friendly operation interface that supports EPOXY IQC and POST IQC graphic display.