Recently, the Ministry of Industry and Information Technology (MIIT) officially announced a new batch of national-level specialized, refined, distinctive and innovative "little giant" enterprises. Dongguan PrecisioNext Intelligent Technology Co., Ltd. (hereinafter referred to as "PrecisioNext"), a leading domestic manufacturer of high-end semiconductor packaging equipment, was successfully selected due to its outstanding technological innovation capabilities, deep R&D accumulation, and excellent market performance in the field of semiconductor packaging equipment. This national-level honor not only marks that PrecisioNext has entered a new stage of development, but also reflects the high recognition at the national level of its contribution to promoting independent and controllable development in key links of the industrial chain.
National-Level Specialized, Refined, Distinctive and Innovative "Little Giant" Enterprise
"Specialized, refined, distinctive and innovative little giant" enterprises refer to pacesetting enterprises that focus on niche markets, have strong innovation capabilities, high market share, master key core technologies, and excel in quality and efficiency. As a highly prestigious honor in national-level enterprise evaluation, this selection is dedicated to cultivating a group of small and medium-sized enterprises that are positioned at key links of the industrial chain, capable of making breakthroughs in core technologies, and equipped with strong competitiveness. They are an important supporting force for the high-quality development of China's manufacturing industry.
Being recognized as a national-level "specialized, refined, distinctive and innovative little giant" this time is not only an affirmation of PrecisioNext's technological strength and commercial potential, but also high recognition of its commitment to independent innovation and serving national strategies. It demonstrates the technological barriers and brand moat the company has built in its niche track.
A Breakthrough Player in Domestic High-End Semiconductor Packaging Equipment
At present, although China's manufacturing scale ranks among the top in the world, it still faces many challenges in fields such as high-end chips. As AI technology drives a surge in demand for high-performance chips such as GPUs and HBM, advanced packaging technology has become the commanding height of industrial competition. However, the domestic advanced packaging industry still relies heavily on imported equipment, which has become a key bottleneck constraining the "Strong Chip" strategy.
Since its establishment in 2017, PrecisioNext has been committed to building an internationally leading high-end semiconductor equipment platform. The company has built a fully independent and controllable underlying technology system, with products covering advanced packaging, optical communication packaging, IC packaging, and other fields, laying a solid foundation for the independent development of domestic high-end equipment.
In the field of advanced packaging, in response to AI chips' demand for advanced packaging such as CoWoS and HBM, PrecisioNext has launched the Loong series TCB thermocompression bonders, achieving ±1 μm placement accuracy, supporting fluxless TCB processes and direct copper bonding, and successfully breaking the foreign technology monopoly. For panel-level packaging, the XBonder series mass-transfer panel-level needle die transfer systems adopt an innovative needle transfer process, achieving ±5 μm accuracy and improving efficiency by 3–8 times, strongly driving innovation in packaging technology.
In the field of optical communications packaging, for the packaging of 400G/800G/1.6T optical modules, CPO, and optical components, PrecisioNext's DA403/Light2300 series ultra-high-precision die bonders and EU403H series thermocompression welding die bonders provide ±3 μm placement accuracy, support COB die bonding, COC eutectic bonding, and thermocompression welding processes, and have been recognized by the world's largest optical module manufacturer.
In the field of IC packaging, the DA1201/DA801 series IC inline die bonders and Clip Bonder series high-speed clip bonding lines support flip-chip and face-up processes, with placement accuracy of ±7–25 μm, and have been recognized by multiple leading IC packaging and testing companies. In addition, the Lion 2300 series ultra-high-precision die bonders and EU2300 series high-precision eutectic die bonders have also been widely adopted by domestic and international automotive-grade LED packaging and testing companies in high-power LED packaging.
A New Starting Point, A New Future
Mr. Meng, head of PrecisioNext, said: "We are deeply honored to receive the national-level 'Little Giant' title, and we are also aware of the responsibility it entails. This is both a milestone and a new starting point. In the future, PrecisioNext will continue to uphold the mission of 'Driving future manufacturing with technology,' further increase R&D investment, focus on customer needs, and continue to break through technical bottlenecks in high-end semiconductor packaging equipment, contributing to China's hard tech in the post-Moore era. We will pursue steady and sustained progress, helping China's chip industry move toward a higher-quality future."
