DA402 Ultra-high Precision Die Attach-Precision Intelligent Technology Co., Ltd

Product features

DA402 Ultra-high Precision Die Attach

High Precision:
X/Y placement accuracy: ±3µm @3σ;
Theta placement accuracy: ±0.3°@3σ;
High speed: placement cycle time <4s (depending on the material);
Supporting the placement of multiple wafers and AB Die of different sizes;
High automation, automatic loading and unloading transmission system, automatic glass sheet cyclic pick-and-place test function (BMC), etc.;
Providing high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the labor cost.


High Precision X/Y placement accuracy: ±3µm @3σ; Theta placement accuracy: ±0.3°@3σ; Repositioning accuracy:±0.5µm@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	High Speed Placement cycle time < 4s (depending on the material);	High Automation Available to choose from top-view or bottom-view vision system for automatic positioning; Automatic loading and unloading transmission system; Automatic glass sheet cyclic pick-and-place test function (BMC).

High Error-proof Function Support glue dispensing, glue quantity detection and alarm function; Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost.	Pattern Recognition System USB 3.0, CCD, 2448x2048 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.1 degrees;	Control System Highly stable force control system uses voice coil twisting ring and encoder to control the bonding pressure. The bond force is programmable varying from 20 to 800g; User-friendly interface supports EPOXY IQC and POST IQC graphic display.