DA402 Ultra-high Precision Die Attach

    Product features

  • DA402 Ultra-high Precision Die Attach

    High Precision:

    X/Y placement accuracy: ±3µm @3σ;

    Theta placement accuracy: ±0.3°@3σ;

    High speed: placement cycle time <4s (depending on the material);

    Supporting the placement of multiple wafers and AB Die of different sizes;

    High automation, automatic loading and unloading transmission system, automatic glass sheet cyclic pick-and-place test function (BMC), etc.;

    Providing high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the labor cost.

  • Return to the top

  • +86-769-26622766-816

  • Scan the code to open mobile website

  • Scan the code by WeChat to follow us