DA402 Ultra-high Precision Die Attach-Precision Intelligent Technology Co., Ltd

Product features

DA402P/DA402S Ultra-high Precision Die Attach

High Precision:
X/Y placement accuracy: ±10μm @3σ;
Theta placement accuracy: DA402P: ±0.3°@3σ;
DA402S: ±0.15°@3σ;
High speed: placement cycle time ≤4.5s (depending on the material);
Supporting the placement of multiple wafers and AB Die of different sizes;
Supports 6 pcs of 6" wafer rings (8" optional if required), with placement of dies of different sizes;
Supports dual ejector pin system;
Supports dispensing and painting;
Configurable with UV curing, closed-loop force control and other functions.
Auto IQC system, SECS/GEM supported.


High Precision X/Y placement accuracy: ±3μm @3σ; Theta placement accuracy: DA402P: ±0.3°@3σ; DA402S:±0.15°@3σ； High precision linear motor; Secondary positioning platform to confirm the accuracy and angle.	High Speed Placement cycle time ≤4.5s (depending on the material); Supports 6 pieces of 6" wafer rings (8" optional if required), with placement of dies of different sizes.	Supports dual ejector pin system Supports dual ejector pin system; Supports dispensing and painting; Configurable with UV curing, closed-loop force control and other functions.

High Error-proof Function Supporting glue dispensing, glue quantity detection and alarm function; Auto IQC system, SECS/GEM supported.	Pattern Recognition System USB 3.0, CCD,4096x3072 pixel; 256-grayscale; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy is ±0.01deg.	Force Control System Highly stable force control system, using VCM and encoder to control bond force. Can adjust the force by programming. Ranging from 30~500g (Progammable); Friendly operation interface that supports EPOXY IQC and POST IQC graphic display.