-Precision Intelligent Technology Co., Ltd

Product features

EU403 High Precision Eutectic Die Bonder

High Precision: X/Y placement accuracy: ±3μm@3σ;
Theta placement accuracy: ＜0.1°@3σ;
High speed: COC placement cycle time ≤10s (Excluding temperature curve);
Supporting the placement of multiple wafers and AB Die of different sizes;
Automatic nozzle changer;
High automation, automatic loading and unloading transmission system, automatic glass sheet cyclic pick-and-place test function (BMC), etc.;
Auto IQC system, SECS/GEM supported.


High Precision X/Y placement accuracy: ±3µm @3σ; Theta placement accuracy: ＜0.1°@3σ; Repositioning accuracy:±0.5µm@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	Supporting Multiple Wafers Supporting 6pcs 6" wafers and AB die of different sizes; Equipped with double ejector tools； Optional automatic nozzle changer; Closed loop force control (customizable).	Dual Eutectic Welding System The temperature rise and fall of ultra fast eutectic welding, with a maximum of 450°C and the speed of temperature rise is 50-80°C/s; Equipped with nitrogen protection gas, real-time display of temperature curve.

High Error-proof Function Support glue dispensing, glue quantity detection and alarm function; Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost.	Pattern Recognition System USB 3.0, CCD, 4096x3072 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.1 degrees;	Control System Highly stable force control system uses voice coil twisting ring and encoder to control the bonding pressure. The bond force is programmable varying from 10 to 500g; User-friendly interface supports EPOXY IQC and POST IQC graphic display.