DA1201FC Flip Chip and Die Attach-Precision Intelligent Technology Co., Ltd

Product features

DA1201FC Flip Chip and Die Attach

X/Y placement accuracy:
Flip-chip/high-precision die attach mode: ±10-15μm@3σ;
Die attach mode: ±10-25μm@3σ;
Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic high-speed flip chip solution for various devices, such as SOIC, SO, QFN, BGA, LGA, etc. At the same time, it is equipped with die attach system;
High-speed and high precision die bonding capability;
MS Windows® operating system and flexible connectivity;
Flip chip and die bonding in one machine - the conversion between the two processes is simple and easy;
Comprehensive inspection system;
High density lead frame handling capability.


Flip Chip and High Precision Die Attach X/Y placement accuracy: ± 10-15µm@3σ; Theta placement accuracy: 5mm≤Die size≤10mm ±0.15°@3σ 1mm≤Die size≤5mm ±0.3°@3σ 0.25mm≤Die size≤1mm ±1°@3σ	Die Attach X/Y placement accuracy: ± 10-25µm@3σ; Theta placement accuracy: Die size≥1mm ±0.5°@3σ Die size≤1mm ±1°@3σ	Highly automated Highly automated. Equipped with fully automatic feeding and discharging magazine processing system that supports SEMI online communication protocol and SECS / GEM protocol;High intelligence, Automatic glue volume and bond placement compensation based on inspection system.

Pattern Recognition System 1280 x 640 pixels (Customizable); Multi-color; Angular accuracy ± 0.1 degrees; Highly intelligent vision system supports automatic inspection of glue volume, shape, position and die placement.	Control System High precision force control system uses voice coil to control the bonding pressure. The bond force is programmable to vary from 20 to 1000g; User-friendly interface supports EPOXY IQC and POST IQC graphic display.	High Compatibility High compatibility. It supports multiple formats map systems; High versatility. It is compatible with all AD8312 series tools from Company A; High customization. It can be customized based on customer requirements.