Suppport high-speed transfer of real MiniLED-level chips. The traditional Pick & Place mode does not support die size <200μm;
Ultra-high-speed, UPH(Unit Per Hour) can reach 120-180K, which is 10 times higher than the traditional Pick & Place mode;
Matured technology: A similar technology with Company A used for the mass-production of MiniLED backlight.
| Advanced Flip Chip COB Die Attach Process|
The ultra-high-speed die attach equipment purposely designed for MiniLED packaging. Exclusively used the flip chip COB die attach process of the chip eject mode, which is a better solution compared with traditional Pick&Place die attachment process.
|Super-high Velocity and High Precision|
Capable of producing chips with a minimal size of 50μm, with 180K-per-hour of fastest output and the precision that can reach up to±15µm.
|Applicable for MiniLED and MicroLED|
Applicable for ultra-high-speed packaging of MiniLED, MicroLED, and discrete devices.
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