XBonder Ultra-high Speed Thorn Die Attach

    Product features

  • XBonder Ultra-high Speed Thorn Die Attach

    Suppport high-speed transfer of real MiniLED-level chips. The traditional Pick & Place mode does not support die size <200μm;

    Ultra-high-speed, UPH(Unit Per Hour) can reach 120-180K, which is 10 times higher than the traditional Pick & Place mode;

    Matured technology: A similar technology with Company A used for the mass-production of MiniLED backlight.


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