Semiconductor Equipment

DA1201 IC Linear High Precision Die Attach DA1201FC Flip Chip and Die Attach DA801 IC Linear High-speed Die Attach Clip Bonder High-speed Clip Bonding System

Photonics Equipment

DA402 Ultra-high Precision Die Attach DA401A Ultra-high Precision Die Attach DA401 Ultra-high Precision Die Attach Lens Bonder High Precision Lens Attach

MiniLED Equipment

XBonder Ultra-high Speed Needle Based Mass Transfer

Core Functional Module

Linear Motor Motion Controller Servo Drives

Semiconductor Packaging Photonics Packaging MiniLED Packaging Power Devices Packaging Advanced Packaging

Company Profile

Company Introduction Core Technologies Management Team Star Shareholders Official Visits Social Responsibility

Company Honor

Social Honor Patent Certificate System Certification

Contact Us

Company News

Exhibitions & Events

Industry Information

Great Video

After-sales Service

Data Download

Social Recruitment

Campus Recruitment