-Precision Intelligent Technology Co., Ltd

Product features

Light 2300FC Flip Chip and Die Attach

Flip chip / Die attach mode:
X/Y placement accuracy: ±3μm @3 σ (standard sheet 1.5μm)；
Theta placement accuracy:±0.1° @3 σ；
Supports flip-chip die bonding process；
High speed: patch cycle ≤4.5S (UPH≥800)；
Electronic control Pick/Bond Force, the maximum Bond Force is 2500g；
Auto suction nozzle change, max 12 nozzles；
Equipped with 5 ejector tools forvarious sizes of Die；
Automatic wafer mapping, maximum support for 12’wafer；
Independently contorlled dual epoxy writing system, and high quantity epoxy control；
Inline supporting with standard function.


High Precision X/Y placement accuracy: ±3µm @3σ; Theta placement accuracy: ±0.1°@3σ; Repositioning accuracy:±0.5µm@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	Supports flip-chip die bonding Supports flip-chip die bonding process; Independently contorlled dual epoxy writing system, and high quantity epoxy control； Automatic wafer mapping, maximum support for 12’wafer； Suitable for packaging such as COB, COS, AOC, BOX, etc.	Automatic nozzle changer Auto suction nozzle change, max 12 nozzles； Equipped with 5 ejector tools for various sizes of Die； Inline supporting with standard function.

High Error-proof Function Support glue dispensing, glue quantity detection and alarm function; Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost.	Pattern Recognition System USB 3.0, CCD, 4000x3000 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.1 degrees;	Control System Highly stable force control system uses voice coil twisting ring and encoder to control the bonding pressure. The bond force is programmable varying from 20 to 2500g; User-friendly interface supports EPOXY IQC and POST IQC graphic display.