Product features
Wafer size: 6"- 12";
Dual dispensing system;
High-precision linear driven bond head;
Support DAF function;
Multifunction work table, suitable for different kinds of lead frames & substrates;
High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;
Intelligent dispensing control system to realize precision glue volume control;
Missing die detection and re-picking function;
Programmable Pick / Bond Force；
Customization for special design is also available.
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| High Precision X/Y placement accuracy: ±10-25µm@3σ; Theta placement accuracy:±1°@3σ. | High Speed Cycle time: 230ms； Highly flexible dual-dispensing system, which supports different epoxy process including dipping / jetting / writing . | Highly automated Highly automated. Equipped with fully automatic feeding and discharging magazine processing system that supports SEMI online communication protocol and SECS / GEM protocol; High intelligence, Automatic glue volume and bond placement compensation based on inspection system. | ||
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| Pattern Recognition System 1920 x 2560 pixels (Customizable); Multi-color; Angular accuracy ± 0.1 degrees; Highly intelligent vision system supports automatic inspection of glue volume, shape, position and die placement. | Control System High precision force control system uses voice20 to 5000g; User-friendly interface supports EPOXY IQC and POST IQC graphic display. | High Compatibility High compatibility. It supports multiple formats map systems; High versatility. It is compatible with all AD8312 series tools from Company A; High customization. It can be customized based on customer requirements. |
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