Product features
High Precision:
X/Y placement accuracy: ±5μm@3σ;
Theta placement accuracy:±0.15°@3σ;
High Speed:
Placement cycle time ≤2s (Depending on the material);
Support feeder, tray and wafer;
High-precision dispensing control system;
Dispensing auto-tunning and auto calibration;
Fully closed-loop force control system;
High-precision bond head, heater bond arm optional;
Optional UV pre-curing function (with automatic UV energy calibration);
Optional dual production line;
Class 100 cleanliness.
High Speed High Precision Placement accuracy: ±5µm @3σ; Theta placement accuracy: ±0.15°@3σ; Placement cycle time ≤2s, ≤8s(Excluding temperature curve); High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle. | Loading and Unloading Way Support feeder, tray and wafer; 2 feeder magazines, no downtime for material changes. | High Precision Dispensing System High precision dispensing control system, supporting custom drawing patterns; Dispensing auto-tunning and auto calibration; Support glue dispensing, glue quantity detection and alarm function. | ||
Operating System Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost; Friendly operation interface that supports EPOXY IQC and POST IQC graphic display. | Pattern Recognition System USB 3.0, CCD, 4096x3072 pixel; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy ± 0.01 degrees; | Control System Highly stable force control system uses voice coil twisting ring and encoder to control the bonding pressure, the bond force is programmable; High-precision bond head, heater bond arm optional. |