Ultra-high Precision Die Attach-Precision Intelligent Technology Co., Ltd

Product features

Lion 2300 Ultra-high Precision Die Attach

High Precision: X/Y placement accuracy: ±5μm@3σ；
Theta placement accuracy: ±0.1°@3σ；
High speed: placement cycle time ≤1.2S;
Flip chip/High-precison die attach mode;
Automatic nozzle changer;
Auto force calibration;
Auto wafer load/unload, Max 8" wafer; map supporting;
Support DAF function: Max 300℃;
High precision jetting/dispensing Epoxy process;
High automation, auto loading and unloading transmission system;
Auto IQC system, SECS/GEM supported.


High Speed & High Precision X/Y placement accuracy: ±5μm @3σ; Theta placement accuracy: ±0.1°@3σ; Placement cycle time: ≤1.2s; Support: Flip chip/ High-precison die attach; Dual positioning: X/Y & Theta placemen.	Mutiple Wafers Standard: Wafer on expander or clamp ring; Optional：Waffle pack, Gel-Pak, tray, tape feeder or by request; Substrate, wafer scanning, tracability mproving.	High Precision Dispensing System Intelligent dispensing control system, painting customized; Precision glue volume control & alarm function; Support DAF function: Max 300℃.

Pattern Recognition System USB 3.0, CCD, 4096x3072 pixel; Color(256-grayscale); Supporting gray value template, custom shape template, standard shape emplate positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy is ±0.01deg.	Control System High stable force control system, using VCM and encoder to control bond force, can adjust the force by programming; Auto bond force control calibration.	Nozzle Change Automatic nozzle changer; High precision DD motor align table.