MiniLED Packaging
MiniLED is a new generation of display technology. In cooperation with the Chinese Academy of Sciences and domestic LED chip enterprises, PrecisioNext creatively developed the COB flip-chip massive transfer device XBonder, an ultra-high speed die attach purposely designed for MiniLED packaging. It uses the COB flip-chip stab die bonding process, that is completely different from the traditional Pick-and-Place die bonding process. It supports minimum die size at 100μm. In addition, the maximum UPH can reach 180K while the placement accuracy is ±15μm@3σ. PrecisioNext Xbonder is the world-leading equipment. Therefore, with the launch of XBonder, the plateau of mass production in the MiniLED division we are facing will be solved.

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