Recently, the Guangdong Provincial Department of Science and Technology officially announced the proposed list of recognized "Guangdong Provincial Engineering Technology Research Centers." Dongguan PrecisioNext Intelligent Technology Co., Ltd. (hereinafter referred to as "PrecisioNext Intelligent"), by virtue of its deep technical accumulation and outstanding innovation strength in the field of semiconductor packaging equipment, was successfully shortlisted and approved to establish the "Guangdong Provincial Engineering Technology Research Center for Intelligent Equipment for Advanced Semiconductor Packaging." The recognition of this provincial-level innovation platform is not only a high affirmation of PrecisioNext's technological innovation and industrialization capabilities, but also marks that the company has entered a new stage on the road to leading the development of domestically produced advanced packaging equipment.
Shouldering the Mission, Tackling "Chokepoint" Problems in High-End Equipment
At present, the semiconductor industry has become a strategic high ground in global technological competition. As a key path to transcend Moore's Law and improve chip performance and integration, advanced packaging technology makes the independent controllability of its core equipment crucial. For a long time, the high-end packaging equipment market has been dominated by international giants. Since its establishment in 2017, PrecisioNext Intelligent has always been committed to building an internationally leading high-end semiconductor equipment platform, focusing on cutting-edge fields such as advanced packaging, optoelectronic packaging, and Mini/Micro LED mass transfer, and adhering to independent R&D and technological innovation.
The approval to establish a provincial-level engineering technology research center this time is an authoritative endorsement of PrecisioNext's continuous investment and outstanding contributions in this field. The research center will rely on PrecisioNext's core technology platforms in high-precision motion control, machine vision, linear motors, algorithms and software, etc., and focus on cutting-edge technology research and engineering breakthroughs around core intelligent equipment in advanced packaging processes.
Technology Leadership, Building Benchmark Products of Domestic Equipment
PrecisioNext Intelligent has achieved a series of breakthrough results in the field of advanced packaging equipment, and its core product lines are highly competitive in both the domestic and global markets:
In the field of advanced packaging, in response to AI chips' demand for advanced packaging such as CoWoS and HBM, PrecisioNext has launched the Loong TCB thermocompression bonder, achieving ±1 μm placement accuracy, supporting fluxless TCB processes and copper-copper bonding, and successfully breaking the foreign technology monopoly. For panel-level packaging, the XBonder mass-transfer panel-level needle die transfer system adopts an innovative needle transfer process, achieving ±5 μm accuracy and improving efficiency by 3–8 times, strongly driving innovation in packaging technology.
In the field of optoelectronic packaging, for the packaging of 400G/800G/1.6T optical modules, CPO, and optical components, PrecisioNext has launched the DA403/Light2300 ultra-high-precision die bonder, EU403H thermocompression welding die bonder, and FAB120/FAB150 fiber array placement machines. The product series supports COB die bonding, COC eutectic bonding, thermocompression welding, and other processes, and has been recognized by the world's largest optical module manufacturer.
In the field of IC packaging, the DA1201/DA801 IC inline die bonders and Clip Bonder high-speed clip bonding lines support flip-chip and face-up processes, with placement accuracy of ±7–25 μm, and have been recognized by multiple leading IC packaging and testing companies. In addition, the Lion 2300 ultra-high-precision die bonder and EU2300 high-precision eutectic die bonder have also been widely adopted by domestic and international automotive-grade LED packaging and testing companies in high-power LED packaging.
The establishment of this engineering center will systematically integrate R&D resources, establish closer cooperative relationships with companies across the semiconductor industry chain, universities, and research institutes, and jointly build an integrated innovation ecosystem of "industry, academia, research, and application." It will continue to launch more advanced, smarter, and more reliable packaging equipment, providing solid equipment support for domestic and international packaging and testing companies.
Looking to the Future, Leading a New Journey in Industry Development
The successful establishment of the provincial-level engineering technology research center this time is an important milestone in the development history of PrecisioNext Intelligent. The head of the company said: "This is an honor, and even more a responsibility. PrecisioNext will take this opportunity to further increase R&D investment, use the engineering center as an innovation engine, focus on customers' most urgent needs, and overcome more cutting-edge technical challenges. Our goal is to become one of the core suppliers in the global advanced semiconductor packaging equipment field, and to contribute core equipment strength to the independent security and high-quality development of China's semiconductor industry chain."
Looking ahead, PrecisioNext Intelligent will continue to deepen its cultivation in the high-end semiconductor equipment track, using innovation as the pen and practical work as the ink, to write a new chapter in the rise of domestic semiconductor equipment, help China's chip industry break through encirclement and move to the center of the world stage.
