Wafer size: 6"- 8";
Dual dispensing system;
High-precision linear driven bond head;
Support DAF function;
Multifunction work table, suitable for different kinds of lead frames & substrates;
High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;
Intelligent dispensing control system to realize precision glue volume control;
Missing die detection and re-picking function;
Customization for special design is also available.
X/Y placement accuracy: ± 25µm @3σ (DA801)；± 10-20µm @3σ (DA801S/DA801M)；
Theta placement accuracy: ±1°@ 3σ。
Cycle time: 220ms；
Highly flexible dual-dispensing system supports different epoxy process including dipping / jetting / writing.
High intelligence. Equipped with fully automatic feeding and discharging magazine processing system that supports SEMI online communication protocol and SECS / GEM protocol;High intelligence, Automatic glue volume and bond placement compensation based on inspection system.
|Pattern Recognition System|
640 x 480pixel (Customizable);
Angular accuracy ± 0.1 degrees;
Highly intelligent vision system that supports automatic inspection of glue volume, shape, position and post-bonding.
High precision force control system uses voice coil to control the bonding pressure.
The bond force is programmable to vary from 30 to 500g;
Friendly operation interface that supports EPOXY IQC and POST IQC graphic display.
High compatibility. It supports multiple formats map systems;
High versatility. It is compatible with all AD8312 series tools from Company A;
High customization. It can be customized based on customer requirements.
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