Product features
Wafer size: 6"- 8";
Dual dispensing system;
High-precision linear driven bond head;
Support DAF function;
Multifunction work table, suitable for different kinds of lead frames & substrates;
High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;
Intelligent dispensing control system to realize precision glue volume control;
Missing die detection and re-picking function;
Customization for special design is also available.
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High Precision X/Y placement accuracy: ± 25µm @3σ (DA801);± 10-20µm @3σ (DA801S/DA801M); Theta placement accuracy: ±1°@ 3σ。 | High Speed Cycle time: 220ms; Highly flexible dual-dispensing system supports different epoxy process including dipping / jetting / writing. | Highly automated High intelligence. Equipped with fully automatic feeding and discharging magazine processing system that supports SEMI online communication protocol and SECS / GEM protocol;High intelligence, Automatic glue volume and bond placement compensation based on inspection system. | ||
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Pattern Recognition System 640 x 480pixel (Customizable); Multi-color; Angular accuracy ± 0.1 degrees; Highly intelligent vision system that supports automatic inspection of glue volume, shape, position and post-bonding. | Control System High precision force control system uses voice coil to control the bonding pressure. The bond force is programmable to vary from 30 to 500g; Friendly operation interface that supports EPOXY IQC and POST IQC graphic display. | High Compatibility High compatibility. It supports multiple formats map systems; High versatility. It is compatible with all AD8312 series tools from Company A; High customization. It can be customized based on customer requirements. |