DA801 IC Linear High-speed Die Attach

    Product features

  • DA801 IC Linear High-speed Die Attach

    Wafer size: 6"- 8";

    Dual dispensing system;

    High-precision linear driven bond head;

    Support DAF function;

    Multifunction work table, suitable for different kinds of lead frames & substrates;

    High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;

    Intelligent dispensing control system to realize precision glue volume control;

    Missing die detection and re-picking function;

    Customization for special design is also available.

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