More advanced packaging processes and technologies are chosen due to the high demands on the power device semiconductor that allowed working in high current and high voltage conditions. Clip bonding is used to replace wire bonding with its advantages in low resistance, inductance and heat impedance. Modular packaging is another advanced technology. PrecisioNext Clip Bonder power semiconductor packaging line provides an all-in-one solution for diode, transistor, MOSFET and power management IC, it includes die bonding, clip bonding and reflow soldering in one product station. The performance has been recognized by PINGWEI, CR MICRO and other industrial partners.