Semiconductor Equipment
Suitable for IC packaging, advanced packaging, power device packaging, etc., with a placement accuracy up to ±10-25μmPhotonics Equipment
Suitable for mounting optical modules, HDMI/USB, TEC, Lens, etc., with a placement accuracy up to ±0.3-3μmMiniLED Equipment
The world’s leading flip COB pricking process, with the highest UPH up to 360K, and a placement accuracy up to ±15μmPrecisioNext
China High-end Equipment Platform Enterprise+
Technology Patent+
Research & Development Team+
Production Capacity