From December 20th to 21st, the 19th China Semiconductor Packaging & Testing Seminar (CSPT2021) hosted by CEPEM was held in Jiangyin. With the theme of "innovation and leadership, cooperation and win-win, and joint construction of the chip manufacturing industry chain", this seminar focuses on the chain of the semiconductor packaging and testing industry, and this seminar focuses on industry hot issues such as advanced packaging technology, packaging and testing technology, equipment, and materials.