On March 28, the world's largest and most influential semiconductor feast - SEMICON China 2025 came to a successful conclusion! Pleason (Booth No.: N1-1285), a high-end semiconductor equipment company, made a stunning appearance with a number of star products such as TCB hot press bonding machine Loong (the only HBM/CoWoS TCB equipment in China), XBonder Pro, multi-functional ultra-high-precision machine DA403, high-speed clamp welding system Clip Bonder, etc.! This double-star debut has attracted extensive attention from customers and professionals in the global semiconductor industry!
Highlight Moment: SEMICON China2025 Live Hit
As the vane of the global semiconductor industry, SEMICON China2025 brings together leading enterprises and technical experts in all aspects of the semiconductor industry chain, so that customers can not only see the cyclical changes of the semiconductor industry, but also observe the technological evolution of various segments in detail, and experience the development determination and action of the entire industry!
Under the hottest spotlight in Hall N1, two "Chinese" devices are subverting industry perceptions. As the world's first mass transfer FOPLP board-level stabbing machine, the XBonder Pro launched by Pleson quickly became the focus of the exhibition, and the TCB hot press bonding machine Loong also relied on the core advantages of the industry's blank in the industry, the only domestic HBM/CoWoS TCB equipment, to "go out of the circle" at the exhibition! Pleason service team has received more than 5,000 customers at home and abroad, and more than 100 technical in-depth negotiations and on-site measurements!
Breaking the Boundaries Highlight Analysis
TCB Thermo Bonding Machine Loong
Pleasson TCB hot press bonding machine Loong can be compatible with C2W and C2S package forms, with a placement accuracy of ±1μ m@3 σ, and supports TC-NCF, MR-MUF and other bonding processes; The Loong F integrated formic acid reduction system effectively eliminates the adverse effects of flux in the stacking process, overcomes the problem of copper interconnect oxidation, and realizes IO pitch ≤ 15μm ultra-fine pitch fluxless bonding.
Mass Transfer Panel-Level Die Piercing Machine XBonder Pro
XBonder Pro adopts the leading flip chip thorn process, the wafer is flipped, the substrate is placed under it and fixed, the needle and wafer move relative to the substrate at the same time, and the chip is transferred to the substrate by needle punching, which greatly reduces the movement distance and improves the efficiency, the placement accuracy is controlled within ±15μm, the highest precision ±5μm, the UPH reaches up to 180K, and the UPH of high-precision placement reaches about 30K, because there is no loss of nozzles or inconsistency of multiple nozzles. The utilization rate of Thorn Crystal is much higher than that of traditional high-precision multi-head equipment, and the efficiency is 3-8 times higher than that of traditional equipment, which has the advantages of great efficiency improvement and cost reduction.
Multi-functional ultra-high precision die bonder DA403
DA403 placement accuracy can reach ±3μ m@3 σ and even submicron; It can support 6 wafer rings at the same time, and support chip placement with multiple chips and complex structures; It has the function of automatic nozzle change, and supports up to 12 different nozzles; Provide high-precision and high-precision PostBond data to significantly reduce labor costs.
High-speed clip welding system Clip Bonder
The one-stop solution for the power semiconductor packaging Clip process launched by Pleas integrates the company's die bonding machine and vacuum furnace to provide power device packaging customers with a whole line solution from die bonding, pinch soldering to reflow soldering, and is the second manufacturer in the world to provide high-end Clip process overall solutions!
Go to the world and draw a trillion blueprints
During the exhibition, the disruptive innovation of TCB hot press bonding machine Loong and mass transfer panel-level piercing machine XBonder Pro was unanimously recognized by customers from South Korea, Japan, Italy, the United States and other countries, and many overseas customers expressed their willingness to further cooperate and work together to write a win-win chapter.
When the lights for the dismantling faded out, the slogan "Precisio Next" on the booth still flickered in the dark. During the three-day exhibition, Plaxin Intelligent delivered not only the equipment parameter table, but also a commitment to China's intelligent manufacturing - in the no-man's land of precision and efficiency, Plaxin will always choose to be the pioneer of lighting the torch!
