Semiconductor Equipment
Suitable for IC packaging, advanced packaging, power device packaging, etc., with a placement accuracy up to ±10-25μmPhotonics Equipment
Suitable for mounting optical modules, HDMI/USB, TEC, Lens, etc., with a placement accuracy up to ±0.3-3μmAdvanced Packaging Equipment
Suitable for advanced packaging such as TCB, FOPLP, Fan out, SiP, etc., with a placement accuracy up to ± 1 μ mPrecisioNext
China High-end Equipment Platform Enterprise+
Technology Patent+
Research & Development Team+
Production Capacity