DA401A Ultra-high Precision Die Attach

    Product features

  • DA401A Ultra-high Precision Die Attach

    High Precision:

    X/Y placement accuracy: ±3µm @3σ;

    Theta placement accuracy: ±0.3°@3σ;

    Supporting multiple wafers, and is compatible with AB Die of similar size;

    High automation, automatic loading and unloading transmission system, automatic glass sheet cyclic pick-and-place test function (BMC), etc.;

    Providing high-precision and micro-motion PostBond data, No manual retest is needed after placement, which greatly reduces the production labor.

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