DA401 Ultra-high Precision Die Attach-Precision Intelligent Technology Co., Ltd

Product features

DA401 Ultra-high Precision Die Attach

High Precision:
X/Y placement accuracy: ±3µm @3σ;
Theta placement accuracy: ±0.3°@3σ;
Supporting multiple wafers, and is compatible with AB Die of similar size;
High automation, automatic loading and unloading transmission system, automatic glass sheet cyclic pick-and-place test function (BMC), etc.;
Providing high-precision and micro-motion PostBond data, No manual retest is needed after placement, which greatly reduces the production labor.


High Precision X/Y placement accuracy: ±3µm@3σ; Theta placement accuracy: ±0.3°@3σ; High precision linear motor; Secondary positioning platform to calibrate the accuracy and angle.	Repositioning Accuracy Repositioning accuracy: ±0.5µm@3σ.	High Automation Available to choose from top-view or bottom-view vision system for automatic positioning; Automatic loading and unloading transmission system; Automatic glass sheet cyclic pick-and-place test function (BMC).

High Error-proof Function Support glue dispensing, glue quantity detection and alarm function; Provide high-precision and micro-motion PostBond data. No manual retest is needed after placement, which greatly reduces the production labor cost.	Pattern Recognition System USB 3.0, CCD, 2448x2048 pixels; 256 gray level; Supporting gray value template, custom shape template, standard shape template positioning; Custom search for ROI; Sub-pixel alignment accuracy; Angular accuracy is ±0.01degrees.	Control System High precision force control system uses voice coil to control the bonding pressure. The bond force is programmable to vary from 20 to 300g; User-friendly interface supports EPOXY IQC and POST IQC graphic display.