Semiconductor equipment company PrecisioNext recently brought its latest R & D equipment to SEMICON China 2021, the most important semiconductor industry event in China. The new equipment attracted much attention. At this exhibition, PrecisioNext displayed semiconductor equipment covering IC packaging, advanced packaging, optical communication packaging, MiniLED packaging and other fields, providing customers with domestically produced semiconductor equipment solutions.

At this exhibition, the XBonder (mass transfer solution for Mini backlight) brought by PrecisioNext, which exclusively adopts the flip-chip COB die-bonding process in thorn die mode, can support a minimum die size of 50μm, and the fastest production capacity can reach per hour 180K with placement accuracy of ±15μm. There is an opportunity to break the technological monopoly of Apple and K&S in this field and solve the technical bottleneck of the scale of the domestic Mini LED industry.

In the field of die bonder, PrecisioNext has filled the blank of domestic IC die bonder. PrecisioNext's 8-inch and 12-inch high-end IC die bonders have been mass-produced and entered into mainstream packaging companies, covering a variety of packaging forms with relatively high technical requirements such as QFN, DFN, SIP, and other advanced packaging. In the field of optical communication packaging equipment, PrecisioNext's high-precision die bonder has a placement accuracy of ±3μm and a rotation angle of ±0.3°. It is specially designed for high-end optical modules, silicon photonics, and other high-precision packaging products, breaking international manufacturers' monopolies and widely used in the optical communication industry.

At the beginning of February this year, PrecisioNext received 100 million yuan in Series B financing led by ORIZA HOLDINGS and co-invested by old shareholders Yunqi Capital, Lightspeed China, and QF Capital. This round of financing will be used for MiniLED packaging equipment and advanced packaging equipment mass production, accelerate the localization of semiconductor packaging equipment, and help the company to expand production capacity to meet the growing market demand, establish an East China branch, and global market promotion.

"After three years of hard work, 2021 will be a year of vigorous development for PrecisioNext, and it has been recognized by UTAC, HT-Tech, Foxconn, Luxshare, AAC, and many other listed companies at home and abroad. reached a strategic agreement This year's revenue is expected to exceed 200 million yuan, and we will strive to reach 300 million yuan. During the SEMICON China exhibition, PrecisioNext's semiconductor equipment has been widely recognized by industry customers and has reached cooperation intentions with a number of semiconductor packaging and testing factories. This year, PrecisioNext has newly established offices in East China Branch and Dongguan Branch. It is expected that the production capacity will more than double this year to meet the growing customer demand and strive to become a domestic leader in semiconductor packaging equipment." said Tian Xingyin, Chairman of PrecisioNext.