CIOE (China International Optoelectronic Exposition) was grandly opened at the Shenzhen World Exhibition & Convention Center, with a total exhibition area of 160,000 square meters, attracting more than 2,500 exhibitors. PrecisioNext, a Chinese high-end semiconductor equipment company, was invited to participate. PrecisioNext (Booth No. 4C25, Hall 4) brought an ultra-high-precision die bonder and a lens attach machine to the show in order to provide high-precision packaging equipment and intelligent optical communications solutions.

In the field of optical communication, lens attach has always been a pain point in the industry. The traditional active coupling is labor-intensive; the cost is high, and the yield is unpredictable. The development of passive coupling has always been the demand of the industry. PrecisioNext designed with lens and PCB technology, and successfully developed a high-precision lens attach. The device has its own UV curing function, the placement time is within 20 seconds (with UV curing), and the placement accuracy reaches ±3μm , not only greatly saves manpower, improves factory automation and production capacity, but also greatly reduces production costs and wins market competitiveness for customers.

PrecisioNext has been committed to the development and production of cost-effective and high-precision equipment. The DA402 high-precision die bonder has been launched, with a placement accuracy of ±3μm, an angle accuracy of ±0.3°, and an output per hour (UPH) of more than 800, breaking the The foreign technology monopoly is completely comparable to the international leading equipment, and it is specially designed for high-precision packaging products such as optical modules and silicon photonics. support multi-wafer, AB Die, provide high-precision Post Bond data, etc. At present, it has been recognized by customers in the optical communication industry such as Luxshare, O-Net, and AFA.