PrecisioNext showed SiP and MEMS advanced packaging equipment at ELEXCON & Embedded System Expo and won the SiP Pioneer Award.

Release date:2022-06-24

From September 27th to 29th, 2021, ELEXCON & Embedded System Expo will be held at the Shenzhen World Exhibition & Convention Center. As a representative enterprise of high-end semiconductor equipment, PrecisioNext was invited to participate. PrecisioNext brought IC high-precision die bonder DA801M (MEMS packaging) and IC high-precision die bonder DA1201 (12" wafer) to the exhibition, which are for MEMS packaging, System In a Package (SiP) and other fields providing high-end equipment and intelligent solutions. During the exhibition, PrecisioNext won the SiP Pioneer Award for its outstanding performance in the field of SiP.




At the same time, on September 28-29, 2021, SiP Conference China 2021 was held at the Shenzhen World Exhibition & Convention Center. Meng Jinhui, general manager of PrecisioNext, attended this conference and gave a speech: Advanced Packaging After Moore, Die-bonding The Solution's Technical Progress.




In the field of die bonder, PrecisioNext has filled the blank of domestic IC die bonder. PrecisioNext's 8-inch/12-inch high-end IC die bonders have a placement accuracy of ±10-25μm, and an angle accuracy of ± 1°, the output per hour (UPH) reaches 18K, suitable for packaging such as QFN, DFN, CSP, SiP, etc., with a high concentration of multiple chips. The thinnest chip reaches 50um. Used in advanced packaging, PrecisioNext's IC high-precision die bonder DA801S/DA801M is widely used in system in a package (SiP), such as MEMS (microphone), radio frequency modules, optical modules, and other fields. It has been recognized by domestic and foreign mainstream packaging and testing companies, such as Foxconn, FM, WXHG, GTBF, and RMT.

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