From September 27th to 29th, 2021, ELEXCON & Embedded System Expo will be held at Shenzhen World Exhibition & Convention Center. As a representative enterprise of high-end semiconductor equipment, PrecisioNext was invited to participate. At that time, PrecisioNext will bring IC high-precision die bonder DA801M (8" wafer) and DA1201 (12" wafer) to the exhibition, providing high-end products for system in a package (SiP) and other equipment and intelligent solutions.
At the same time, on September 28-29, 2021, the 5th SiP Conference China will be held at the Shenzhen Exhibition & Convention Center. Meng Jinhui, general manager of PrecisioNext, will attend the SiP Conference China 2021 to give a speech on the theme of Post-Moore's advanced packaging and the technological advances of Die Bonder.
Return to the top
Scan the code to open mobile website
Scan the code by WeChat to follow us