PrecisioNext brought die bonder and lens attach to CIOE

Release date:2022-06-24

On September 16-18, 2021, CIOE (China International Optoelectronic Exposition) was grandly opened at the Shenzhen World Exhibition & Convention Center, with a total exhibition area of 160,000 square meters, attracting more than 2,500 exhibitors. PrecisioNext, a China high-end semiconductor equipment company, was invited to participate. PrecisioNext (Booth No.: 4C25, Hall 4) brought ultra-high-precision die bonder and lens attach machine to the exhibition to provide high-precision packaging equipment and intelligent solutions for optical communications.


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