From November 3 to 5, 2020, productronica South China was held in the Shenzhen World Exhibition & Convention Center, and PrecisioNext presented the latest semiconductor equipment. The high-precision die bonder and the 8-inch/12-inch IC die bonder provide high-precision and high-speed packaging solutions for optoelectronic packaging, IC packaging, and other customers, enabling the development and change of the industry.